Electronic Manufacturing Services
Semiconductor manufacturing services providers
· ASE Korea, Inc. - Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test equipment used, and package datasheets are available in PDF.
· Cirtek Electronics Corporation - An independent subcontractor for semiconductor assembly, test and packaging services.
· Dolphin Technology Inc. - Provides a wide range of high performance, high speed silicon-IP. For designers, needing standard or custom IP such as memory, I/O, standard cell libraries, data path modules or analog blocks.
· Eltek Semiconductors Ltd - Procuring and processing semiconductor components in wafer, die and packaged form.
· First Level Inc. - Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
· Honeywell Electronic Materials - Offers interconnect solutions and IC packaging specializing in on-chip semiconductor interconnects, including spin-on dielectrics and sputtering targets. Product and technology briefs, and a description of company's manufacturing cleanroom.
· Incide - A fabless design house focused on RF and high-speed digital integrated designs.
· Jade Precision Engineering Pte Ltd - Singapore-based company providing lead-frame stamping, milling, plating, and taping services for semiconductors. Company history, description of services, and photos of example products.
· PolarFab - Bipolar and BiCMOS wafer manufacturing processes. Bloomington, MN, USA.
· Prema Semiconductor - Fabricates analog and mixed-signal ICs
· Premier Semiconductor Services - Back-end services for commercial, aerospace, and military products including semiconductor taping, BGA balling, and baking.
· Promex Industries Inc. - Microelectronics technologies, specialty chip packaging, design, layout, materials expertise, process engineering for outsourced optoelectronics, microelectronics, chip packaging and manufacturing. From China.
· Protochips Inc. - Offers custom layout and fabrication services for emerging companies and university groups.
· Reltech Limited - European supplier of advanced semiconductor burn-in and reliability test systems.
· Satcon Electronics - Manufacturer standard and custom microelectronic assemblies, thin film substrates, semiconductor packaging and wire bonding. Company overview and list of capabilities.
· Sigurd Microelectronics Corporation - Provides semiconductor IC assembly and testing services.
· Silicon Infusion Limited - Provides single chip solutions for T1/E1/J1, DTMF, ADPCM, and many other telecommunications standards.
· Silterra Malaysia Sdn Bhd - Manufacturer of semiconductors and wafers. Headquarters in Kulim, Kedah, Malaysia.
· Tower Semiconductor LTD. - Independent foundry of semiconductor integrated circuits specializing in embedded nonvolatile memory, CMOS image sensors, and mixed signal devices. 0.35 micron and up. Israel.
· Valtronic - Manufacturers custom miniature modules and packaging, including chip-on-board, flip chip, chip-on-chip, and multichip modules. Include capabilities, and illustrated discussions of packaging technologies and processes.
· WaferTech - Wafer manufacturing, probing, assembly and final test. .25 micron. Fab in Washington State, USA.
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